Hyejeong Seong, Ph.D. / 성혜정
Senior Researcher
OFFICE L7323B, +82-(0)2-958-6955
LAB L7335
E-mail h.seong@kist.re.kr
HOMEPAGE https://sites.google.com/view/kist-bsi-bms-hseong
EDUCATION
Ph.D. Department of Chemical & Biomolecular Engineering, KAIST (2016)
B.S. Department of Chemical & Biomolecular Engineering, KAIST (2011)
EMPLOYMENT
2020. 10 – Present : Senior Researcher, Brain Science Institute, KIST
2018. 10 – 2020. 09: Marie Skłodowska-Curie Individual Fellow, Dept. of Materials, Imperial College London
2017. 09 – 2018. 08: Postdoctoral Fellow funded by NRF in Korea, Dept. of Materials, Imperial College London
2017. 03 – 2017. 08: Postdoctoral Associate, Dept. of Materials, Imperial College London
2016. 08 – 2017. 01: Postdoctoral Associate, KAIST
RESEARCH INTERESTS
- Cell-material interfaces
- Biofunctional polymer thin films
- Organic bioelectronics
REPRESENTATIVE PAPERS
- H. Seong, S. G. Higgins, J. Penders, J. P. K. Armstrong, A. C. Moore, S. W. Crowder, J. E. Sero, M. Becce, M. M. Stevens*, Size-Tunable Nanoneedle Arrays for Influencing Stem Cell Morphology, Gene Expression, and Nuclear Membrane Curvature, ACS Nano 2020, 14, 5371-5381
- H. Seong, J. Choi, B. J. Kim, H. Park, S. G. Im*, Vapor-phase synthesis of sub-15 nm hybrid gate dielectrics for organic thin film transistors, J. Mater. Chem. C. 2017, 5, 4463-4470
- B. C. Jang+, H. Seong+, S. K. Kim, J. Y. Kim, B. J. Koo, J. Choi, S. Y. Yang, S. G. Im*, S. –Y. Choi*, Flexible Nonvolatile Polymer Memory Array on Plastic Substrate via Initiated Chemical Vapor Deposition, ACS Appl. Mater. Interface, 2016, 8, 12951–12958 (Equal contribution)
- H. Moon+, H. Seong+, W. C. Shin+, W. T. Park, M. Kim, S. Lee, J. H. Bong, Y. Y. Noh, B. J. Cho*, S. Yoo*, S. G. Im*, Synthesis of ultrathin polymer insulating layers by initiated chemical vapour deposition for low-power soft electronics, Nat. Mater. 2015, 14, 628-635 (Equal contribution)
- H. Seong, J. Baek, K. Pak, S. G. Im*, A Surface Tailoring Method of Ultrathin Polymer Gate Dielectrics for Organic Transistors: Improved Device Performance and the Thermal Stability Thereof, Adv. Funct. Mater. 2015, 25, 4462-4469